订制的适配器 -金沙娱场城app

we go beyond just package conversion, adapting to your changing requirements from concept to prototype to production.

typical applications and unique features
* transparent interface from a new bga device to existing qfp pads
* patent-pending solder ball connection offers a robust, process compatible, and

   cost effective replacement for fragile qfp leads
* solutions to obsolescence for most smt or thru-hole lead styles
* sourcing and device attach for passive and active components
* stand-offs, solder preforms, smt designs, and more
* contact our product engineers to get started