生产商: | advanced interconnections |
产品类别: | 板对板连接器 |
系列: |
mezza-pede® low profile smt 连接器 (0.39/ (1.00 mm)/ pitch)
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特性: |
with advanced's enclosed screw-machined socket, 6-finger contact and heavy gold plating, mezza-pede® connectors pass the 20-day mixed flowing gas (mfg) test required in many telecom
and other severe environment and long-life applications. our over-molded lead frame seals the surface mount leads to prevent solder wicking, ensuring a secure solder joint. the low
4mm stack height makes it ideal for tight mezzanine packaging applications. * low profile - board to board stack height of only 4.0mm (nom.). * robust design features screw-machined terminals and multi-finger contacts with a per contact current rating of greater than 1 amp at 80°c ambient. * dual row configurations include 8, 14 or 36 total positions with other pin counts available on a customized basis. * fits within existing board layouts. * patented smt lead frame and pin design prevents solder wicking, providing the highest quality solder joint at the pcb level. * smt and thru-hole designs available. * passed 20-day mfg test with heavy gold terminal plating (gh). * qualified for use in telecommunications applications. * rohs compliant |
端子: |
brass - copper alloy (c36000), astm-b-16 |
黄片: | beryllium copper - copper alloy (c17200), astm-b-194 |
插座材料: |
high temp. (molded) lcp liquid crystal polymer header also available in flexible polyimide film. |
产品资料: | |
参考连结: |
1. mezza-pede® smt connectors catalog page data sheet -catalog 16a data sheet featuring detailed table of models, product specifications, typical applications, and part
number selection.
2. mezza-pede® smt connectors application specification - general usage guidelines including pc board design, soldering, cleaning, mating & unmating procedure, etc.
3. mezza-pede® smt connectors product specification - test and performance data, materials specifications, etc
4. contact system test results - product bulletin 2008-01 - contact system test results for 1.00mm pitch products
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