生产商: | advanced interconnections |
产品类别: | 适配器 |
系列: |
bga interposers 适配器 |
特性: |
designed for rohs exempt applications, interposers from advanced solve bga device transition, obsolescence, and solderability issues associated with the higher temperature
requirements to process lead-free bga packages.
* reduces costs associated with device package transition or obsolescence
* lead-free device attach service provided
* industry-proven solder ball terminal design provides the high reliability required in
medical, military, telecom, and automotive applications
* high temperature fr-4 adapter board closely matches original package size
* same footprint as bga device (currently available in 0.80, 1.00, and 1.27mm pitch)
* custom designed to customer's requirements
* tape and reel packaging available
|
端子: |
brass; copper alloy c36000, astm-b-16 |
插座材料: | high temperature fr-4 |
产品资料: | |
参考连结: |
typical soldering process examples
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福基电子有限公司
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传真∶(852) 2542-1524
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免费:400-820-8921