| 生产商: | advanced interconnections |
| 产品类别: | 板对板连接器 |
| 系列: |
b2b® smt 连接器
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| 特性: |
* high density .050" (1.27mm) pitch - over 400 contacts per square inch * robust screw-machined terminals with multi-finger contacts can withstand the demands of blind mating and rigorous mating/unmating cycles * precision molded in high temperature lcp with integral polarization keying features to prevent 180° out-of-orientation mismating * at 3 amps per pin, more contacts can be assigned to data/signal transfer (fewer pins needed to handle power and ground) * guide box design facilitates alignment of male pin into female receptacle while protecting pins from damage during board mating * industry standard footprints in four mated heights (standard stack heights: 6.00mm, 8.00mm, 12.70mm and 19.05mm) * custom configurations available * rohs compliant models available featuring new sn/ag/cu solder ball terminals |
| 端子: |
brass; copper alloy c36000, astm-b-16 |
| 黄片: | beryllium copper alloy c17200, astm-b-194 |
| 插座材料: | high temp. (molded) lcp liquid crystal polymer |
| 产品资料: | |
| 参考连结: |
1. b2b® smt connectors aerospace imaging equipment application note
2. signal integrity simulation and modeling overview
(si profiles, crosstalk, eye-diagrams and conclusions in pdf format)
a. 6.00mm height
b. 8.00mm height
c. 12.70mm height
d. 19.05mm height
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